Past Events Proceedings

4th edition SPCD 2022

Registration Desk Opening

ESCC training course - Part I

Lunch

ESCC training course - Part II

EEE Passives Seminar

ESA Site Tour & Space Expo Museum

Only available to pre-registered participants

Registration Desk Opening

Welcome Speech

Presentation

Introduction & Instructions Speech

Presentation
Technology Roadmaps

Space Passive Components: Activities, News and Trends
Léo FARHAT, Joaquin Jimenez, ESA/ESTEC

Presentation
Commercial Off-The-Shelf (COTS)

Assessment of ECSS-Q-ST-60-13 for COTS Passive Components
Manuel Sánchez, Alter Technology Spain
Manuel Morales

Presentation Final Paper

Networking Coffee Break

 

Application, Trends & Needs

Supercapacitors for space applications: trends and opportunity
Geraldine Palissat, ESA ESTEC
Leo Farhat, Joaquin Jimenez

Presentation Final Paper
Application, Trends & Needs

Improving RF connectivity for space application in Telecom satellites in production environment
Simon Liller, Airbus Defence and Space

Presentation Final Paper
Application, Trends & Needs

Resistive and Wilkinson power splitters at frequencies of millimeter waves for space applications
Mo Hasanovic, Smiths Interconnect

Presentation Final Paper

TICs: 7min per TIC

     

New Micro-D Connector Series   

C&K Components, France

24-fibers interconnect solutions for payload data processing 

Radiall, France

Real breakthroughs in Ta caps technology critical for space applications 

Kemet Yageo, USA

RADATOX™ - New Space ATOX resistant wires and cables     

Axon Cable, France

                               

Lunch

Manufacturers' Private Roadmap: 30min

AXTAL GmbH & Co. KG

Manufacturers' Private Roadmap: 30min

EATON SOURIAU SAS

Poster Session

TICs: 7min per TIC

 

Smiths Interconnect Filters Planar X series for Space Applications

Smiths Interconnect, France

Magnetics for Power Solutions

FLUX, Danemark

Fuel Pipes Heating system, On Exomars Landers

THERMOCOAX, France

AEM Range extensions

AEM, USA

 

 

New Developments

Novel Graphene Material for High Energy Storage Supercapacitors
Tomas Zednicek, EPCI
Michal Otyepka, Aristeidis Bakandritsos, Veronika Sedajova

Presentation Final Paper
New Developments

Miniaturization of high voltage MLCC for space applications
Pascale ESCURE, Exxelia
Nicolas RUSCASSIER

Presentation Final Paper
New Developments

High Energy Density Solid Stare Polymer Capacitors for Space Applications
Angelo Yializis, PolyCharge America Inc

Presentation Final Paper
New Developments

Low profile and solderless solutions for flat space interconnect
Nigel Kellett, Axon' Cable Ltd
Stéphane Hermant

Presentation Final Paper
New Developments

AFSIW Y-junction Circulator for High-power Handling New Space Applications
Issam Marah, Cobham
Anthony Ghiotto, Jean-Marie Pham

Presentation Final Paper
Lessons Learned or In-flight Experiences

Passive EEE parts in the Biomass Payload: challenges and lessons learned
Adriano Carbone, ESA/ESTEC
Leo Farhat, Paloma Villar

Presentation

Welcome Drink

Session Chair & Introduction

 

Technology Roadmaps

TAS Road Map
Dominique DUCASSE, THALES ALENIA SPACE
Corentin GUILBERT, Valerie BOUTAN

Presentation
Test, Reliability & Evaluation for space

Feedback from 10 years of Failure Analysis on connectors – all electronic sectors
Eric ZAIA, Serma Technologies
Cédric FAVAREL

Presentation Final Paper
New Developments

Exxelia new MML technology for film capacitors miniaturization
Tchavdar DOYTCHINOV, EXXELIA

 

Presentation Final Paper
New Developments

Miniature RF switch for compact redundancy ring
Olivier Berenfeld, RADIALL SA
Olivier Vendier

Presentation Final Paper Best Paper Award
New Developments

Novel Single-piece miniature coax for transmission of signals to 67 GHz
Kevin DeFord, Smiths Interconnect
Alain Garric

Presentation Final Paper
Normative System & Standards

Harness sizing approach for bundles equipped with shields
Marc Malagoli, Loïc Delettre, Airbus Defence and Space
Guilhem Chanteperdrix

 

Presentation Final Paper

Networking Coffee Break

Application, Trends & Needs

Supercapacitor for launcher applications
Marc Lichtenberger, ALMATECH SA
Géraldine Palissat, Aurelien Boisset, Leo Farhat

Presentation Final Paper
Commercial Off-The-Shelf (COTS)

The latest activities related to the passive components in JAXA
Kensuke Shiba, JAXA
Akifumi Maru, Koichi Suzuki

Presentation Final Paper
Commercial Off-The-Shelf (COTS)

Proba 3 Mission: ISL Architecture and procurement approach for Passives COTS
Léo FARHAT, ESA/ESTEC
Teodor Bozhanov

Presentation

TICs: 7min per TIC

 

European Passive Components Institute Introduction and PCNS invitation

EPCI, Czech Republic

KVPX - High Speed Backplane Press-Fit Connector

Smiths Interconnect, France

Kyocera AVX High Reliability Components

Kyocera-AVX Ltd, Great Britain

Miniaturized integrated TX/RX feed chain at Ku band

MinWave, Switzerland

Lunch

TICs: 7min per TIC

 

ESCC qualified platinum thin film temperature sensors with cable extension

IST AG, Switzerland

New micro-miniature connector solutions

Axon' Cable Ltd, Great Britain

High power S-band coaxial isolator development at TKI-Ferrit Ltd

TKI-Ferrit Ltd, Hungary

Miniature Temperature Compensated Crystal Oscillators in COTS Technology

AXTAL GmbH & Co. KG, Germany

New Developments

HYPERBITS Connector Design and Qualification for High Reliability CPCI SERIAL SPACE Applications
Gaby Cristian Mindreci, MINDREACH i2i SL
Dimas Morilla

Presentation Final Paper
Test, Reliability & Evaluation for space

WHY QUALIFY PRESS-FIT CONTACTS FOR SPACE FLIGHT APPLICATIONS
STEPHANE DE MONICAULT, AMPHENOL POSITRONIC
GUILLAUME BORDIER

Presentation Final Paper
Materials and Processes

New Space ESD-Resistant smart-antistatic wires and cables insulations
Pierre-Yves Mikus, Axon Cable
Gérard Biscaras, Stéphanie Huguenot

Presentation Final Paper
Materials and Processes

Ka-band compact multi-materials rectangular waveguide loads
Vincent LAUR, Lab-STICC / UBO
Leticia Martinez-Cano, Alexis Chevalier, Azar Maalouf, Julien Ville, Jessica Benedicto, Paul Laurent, Kevin Elis

Presentation Final Paper
New Developments

A new modular micro-D connector for high speed data and RF
Matt Shingleton, Glenair UK LTd.

Presentation Final Paper

Networking Break

Interactive Panel Discussion

Interactive Panel Discussion: "Long Lead Items: shortage, challenges and potential improvements"

Presentation

Gala Dinner @ Beach Pavilion "De Zeemeeuw", Noordwijk

Session Chair & Introduction

Technology Roadmaps

Airbus DS Road-map
Laurent Toudret, Airbus Defence and Space

Presentation
New Developments

Thin film diamond thermistors for space environment applications
Miguel Neto, University of Aveiro
Sérgio Pratas, Eduardo Silva, Ana Girão, Filipe Oliveira, Rui Silva

Presentation Final Paper
New Developments

New generation of wafer-scale, hermetically sealed chip fuses for space
Bruno Zemp, SCHURTER AG

Presentation Final Paper
New Developments

CCM, a family of magnetic components dedicated to space applications and optimized for multi-output flyback converters
Bruno COGITORE, Exxelia

Presentation Final Paper
New Developments

Advances in Hermetic Space Grade Tantalum Polymer Capacitors
Slavomir Pala, Kyocera AVX components
Ron Demcko

Presentation Final Paper

Networking Coffee Break

Evaluation & Qualification

Power surge testing for polymer tantalum capacitors
Alexander Teverovsky, Jacobs Technology Inc./NASA

Presentation Final Paper
Lessons Learned or In-flight Experiences

Details are important. How can the designer help to make cleaning assemblies easy?
Vladimir Sitko, PBT Works s.r.o.

Presentation Final Paper
Lessons Learned or In-flight Experiences

Platinum sensors embedded in ESCC-4006/014 modified contruction: a turbulent tale about the coexistence of dissimilar materials
Bruno Campillo Iglesias, OHB System AG
Premysl Janik, Gabor Milassin, Silvia Massetti, Joaquín Jiménez, Padraic Moran, Manfred Broda, Klaus Wastian, Paola Bruno

Presentation Final Paper
New Developments

ESA recent activities on thermal parts: development and inspection techniques
Philipp Hager, European Space Agency

Presentation
New Developments

Lightest and Smallest Low Earth Orbit Wires and Cables Type LEW according to ESCC 3901/026
Nicole Kaika, W. L. Gore & Associates GmbH
Erwin Zäh, Peter Parketta

Presentation Final Paper

Closing Session & Award Ceremony

Lunch