We use cookies. By browsing this site you agree to the use of cookies. More Information
Accept cookies and continue
Decline
4th edition SPCD 2022
Registration Desk Opening
ESCC training course - Part I
Lunch
ESCC training course - Part II
EEE Passives Seminar
ESA Site Tour & Space Expo Museum
Only available to pre-registered participants
Registration Desk Opening
Welcome Speech
PresentationIntroduction & Instructions Speech
PresentationTechnology Roadmaps
Space Passive Components : Activities, News and Trends
Léo FARHAT, Joaquin Jimenez
ESA/ESTEC
Commercial Off-The-Shelf (COTS)
Assessment of ECSS-Q-ST-60-13 for COTS Passive Components
Manuel Sánchez, Alter Technology Spain
Manuel Morales
Networking Coffee Break
Application, Trends & Needs
Supercapacitors for space applications: trends and opportunity
Geraldine Palissat, ESA ESTEC
Leo Farhat, Joaquin Jimenez
Application, Trends & Needs
Improving RF connectivity for space application in Telecom satellites in production environment
Simon Liller, Airbus Defence and Space
Application, Trends & Needs
Resistive and Wilkinson power splitters at frequencies of millimeter waves for space applications
Mo Hasanovic, Smiths Interconnect
TICs: 7min per TIC
|
New Micro-D Connector Series |
C&K Components, France |
|
24-fibers interconnect solutions for payload data processing |
Radiall, France |
|
Real breakthroughs in Ta caps technology critical for space applications |
Kemet Yageo, USA |
|
RADATOX™ - New Space ATOX resistant wires and cables |
Axon Cable, France |
|
|
Lunch
Manufacturers' Private Roadmap: 30min
AXTAL GmbH & Co. KG
Manufacturers' Private Roadmap: 30min
EATON SOURIAU SAS
TICs: 7min per TIC
|
Smiths Interconnect Filters Planar X series for Space Applications |
Smiths Interconnect, France |
|
Magnetics for Power Solutions |
FLUX, Danemark |
|
Fuel Pipes Heating system, On Exomars Landers |
THERMOCOAX, France |
|
AEM Range extensions |
AEM, USA |
New Developments
Novel Graphene Material for High Energy Storage Supercapacitors
Tomas Zednicek, EPCI
Michal Otyepka, Aristeidis Bakandritsos, Veronika Sedajova
New Developments
Miniaturization of high voltage MLCC for space applications
Pascale ESCURE, Exxelia
Nicolas RUSCASSIER
New Developments
High Energy Density Solid Stare Polymer Capacitors for Space Applications
Angelo Yializis, PolyCharge America Inc
New Developments
Low profile and solderless solutions for flat space interconnect
Nigel Kellett, Axon' Cable Ltd
Stéphane Hermant
New Developments
AFSIW Y-junction Circulator for High-power Handling New Space Applications
Issam Marah, Cobham
Anthony Ghiotto, Jean-Marie Pham
Lessons Learned or In-flight Experiences
Passive EEE parts in the Biomass Payload: challenges and lessons learned
Adriano Carbone, ESA/ESTEC
Leo Farhat, Paloma Villar
Welcome Drink
Session Chair & Introduction
Technology Roadmaps
TAS Road Map
Dominique DUCASSE, THALES ALENIA SPACE
Corentin GUILBERT, Valerie BOUTAN
Test, Reliability & Evaluation for space
Feedback from 10 years of Failure Analysis on connectors – all electronic sectors
Eric ZAIA, Serma Technologies
Cédric FAVAREL
New Developments
Exxelia new MML technology for film capacitors miniaturization
Tchavdar DOYTCHINOV, EXXELIA
New Developments
Miniature RF switch for compact redundancy ring
Olivier Berenfeld, RADIALL SA
Olivier Vendier
New Developments
Novel Single-piece miniature coax for transmission of signals to 67 GHz
Kevin DeFord, Smiths Interconnect
Alain Garric
Normative System & Standards
Harness sizing approach for bundles equipped with shields
Marc Malagoli, Loïc Delettre, Airbus Defence and Space
Guilhem Chanteperdrix
Networking Coffee Break
Application, Trends & Needs
Supercapacitor for launcher applications
Marc Lichtenberger, ALMATECH SA
Géraldine Palissat, Aurelien Boisset, Leo Farhat
Commercial Off-The-Shelf (COTS)
The latest activities related to the passive components in JAXA
Kensuke Shiba, JAXA
Akifumi Maru, Koichi Suzuki
Commercial Off-The-Shelf (COTS)
Proba 3 Mission: ISL Architecture and procurement approach for Passives COTS
Léo FARHAT, ESA/ESTEC
Teodor Bozhanov
TICs: 7min per TIC
|
European Passive Components Institute Introduction and PCNS invitation |
EPCI, Czech Republic |
|
KVPX - High Speed Backplane Press-Fit Connector |
Smiths Interconnect, France |
|
Kyocera AVX High Reliability Components |
Kyocera-AVX Ltd, Great Britain |
|
Miniaturized integrated TX/RX feed chain at Ku band |
MinWave, Switzerland |
Lunch
TICs: 7min per TIC
|
ESCC qualified platinum thin film temperature sensors with cable extension |
IST AG, Switzerland |
|
New micro-miniature connector solutions |
Axon' Cable Ltd, Great Britain |
|
High power S-band coaxial isolator development at TKI-Ferrit Ltd |
TKI-Ferrit Ltd, Hungary |
|
Miniature Temperature Compensated Crystal Oscillators in COTS Technology |
AXTAL GmbH & Co. KG, Germany |
New Developments
HYPERBITS Connector Design and Qualification for High Reliability CPCI SERIAL SPACE Applications
Gaby Cristian Mindreci, MINDREACH i2i SL
Dimas Morilla
Test, Reliability & Evaluation for space
WHY QUALIFY PRESS-FIT CONTACTS FOR SPACE FLIGHT APPLICATIONS
STEPHANE DE MONICAULT, AMPHENOL POSITRONIC
GUILLAUME BORDIER
Materials and Processes
New Space ESD-Resistant smart-antistatic wires and cables insulations
Pierre-Yves Mikus, Axon Cable
Gérard Biscaras, Stéphanie Huguenot
Materials and Processes
Ka-band compact multi-materials rectangular waveguide loads
Vincent LAUR, Lab-STICC / UBO
Leticia Martinez-Cano, Alexis Chevalier, Azar Maalouf, Julien Ville, Jessica Benedicto, Paul Laurent, Kevin Elis
New Developments
A new modular micro-D connector for high speed data and RF
Matt Shingleton, Glenair UK LTd.
Networking Break
Interactive Panel Discussion
Interactive Panel Discussion: "Long Lead Items: shortage, challenges and potential improvements"
PresentationGala Dinner @ Beach Pavilion "De Zeemeeuw", Noordwijk
Session Chair & Introduction
Technology Roadmaps
Airbus DS Road-map
Laurent Toudret, Airbus Defence and Space
New Developments
Thin film diamond thermistors for space environment applications
Miguel Neto, University of Aveiro
Sérgio Pratas, Eduardo Silva, Ana Girão, Filipe Oliveira, Rui Silva
New Developments
New generation of wafer-scale, hermetically sealed chip fuses for space
Bruno Zemp, SCHURTER AG
New Developments
CCM, a family of magnetic components dedicated to space applications and optimized for multi-output flyback converters
Bruno COGITORE, Exxelia
New Developments
Advances in Hermetic Space Grade Tantalum Polymer Capacitors
Slavomir Pala, Kyocera AVX components
Ron Demcko
Networking Coffee Break
Evaluation & Qualification
Power surge testing for polymer tantalum capacitors
Alexander Teverovsky, Jacobs Technology Inc./NASA
Lessons Learned or In-flight Experiences
Details are important. How can the designer help to make cleaning assemblies easy?
Vladimir Sitko, PBT Works s.r.o.
Lessons Learned or In-flight Experiences
Platinum sensors embedded in ESCC-4006/014 modified contruction: a turbulent tale about the coexistence of dissimilar materials
Bruno Campillo Iglesias, OHB System AG
Premysl Janik, Gabor Milassin, Silvia Massetti, Joaquín Jiménez, Padraic Moran, Manfred Broda, Klaus Wastian, Paola Bruno
New Developments
ESA recent activities on thermal parts: development and inspection techniques
Philipp Hager, European Space Agency
New Developments
Lightest and Smallest Low Earth Orbit Wires and Cables Type LEW according to ESCC 3901/026
Nicole Kaika, W. L. Gore & Associates GmbH
Erwin Zäh, Peter Parketta
Closing Session & Award Ceremony
Lunch
