Final Programme

The Final Programme is also available in pdf form:                                                                                 Download Final Programme.pdf

 

 

08:30

Registration Desk Opening

09:30

ESCC training course - Part I

12:00

Lunch

13:00

EEE Passives Seminar 

 

13:00

ESCC training course - Part II

15:30

ESA Site Tour & Space Expo Museum
Only available to pre- registered participants

08:30

Registration Desk Opening

09:30

Welcome Speech - Keynote Talk

09:50

Introduction & Instructions

Application, Trends & Needs
10:10

Space Passive Components: Latest News, Activities, and Trends
Léo Farhat, ESA/ESTEC
Joaquín Jiménez

Application, Trends & Needs
10:40

L4: Moons of the Giant Planets: it will be cold, dark and far away from home
Sven Wittig, ESA

11:00

Networking break

Technology Roadmaps
11:30

Roadmap for Space Harness - Vision and Opportunities for DC Harness Technologies
Marc Malagoli, Airbus Defence and Space

Materials and Processes
11:50

Flat Cable Harness for Space Launcher Applications
Jesús Aspas Puértolas, ArianeGroup
Bruno Thomas, Nicolas Maisonnave, Joost van Tooren, Emilien Fournaise, Gilles Rouchaud, Stéphane Hermant, Léo Farhat, Joaquín Jiménez

Technical Introduction of Components (TICs)
12:10

TICs: 7 min per TIC

 

Aerospace product portfolio of Littelfuse (C&K)

Littelfuse C&K - NL

Expect More Technology - Peltier Thermo-electric generators TEG/TEM

Isabellenhütte Heusler- Germany

Automotive Polymer Tantalum Capacitors with capabilities beyond AEC-Q200. 

KEMET Electronics - Portugal

Heatbind - Advanced solid thermal retainer incorporated in monoblock

card frame for conduction cooled system

PERFORMANCE INTERCONNECT SAS France

Planar Magnetics for Space Applications

Payton America Inc, USA

Harp Technologies company overview and ferrite components

Harp Technologies Oy, Finland

 

13:00

Lunch

Manufacturers' Private Roadmap
14:00

AXON' cable

Private Roadmap Session

Manufacturers' Private Roadmap
14:00

Isabellenhütte - Expect More!

Daniel Theis, Isabellenhütte Heusler GmbH

Private Roadmap Session

14:30

Poster Session

VIEW ALL POSTERS
Technical Introduction of Components (TICs)
15:30

TICs: 7 min per TIC

     

Next-Gen Crystal Oscillators for advanced New Space applications

AXTAL GmbH, Germany

T27 Hermetic Polymer: Designed for Long-Term High Performance and Stability Vishay, USA
KAVX roadmap on hi-rel Ta-capacitors field Kyocera AVX, Czech Republic
New SPL Series of fixed attenuator and Thermopad® Smiths Interconnect, France

New Developments
16:00

SMD Compatible LTCC Circulators in Ku-Band
Norbert Parker, IMT-Atlantique
Laurent Roussel, Richard Lebourgeois, Camilla Kärnfelt, Vincent Laur

New Developments
16:20

The Benefits of Using High-Reliability Polymer Tantalum Capacitors
James Turner, KEMET/YAGEO

New Developments
16:40

SWAP-C Ka-Band High Power Duplexer Based on the Emerging AFSIW Technology
Issam Marah, Exens Solutions
Anthony Ghiotto, Jean-Christophe Plumecoq, Savas Kurt, Richard Tyan

New Developments
17:00

Fast-lock ZIF interconnections and connectorless flat cables
Gilles Rouchaud, Axon
Julien Logette, Alan Le Hagarat, Stéphane Hermant, Chantal Le Graet, Lindsay Turot

Technology Roadmaps
17:20

Technological challenges and roadmap for flexible heaters
Alessandra Marcer, IRCA s.p.a. Zoppas Industries
Damien Daran

Application, Trends & Needs
17:40

Selection of POGO-Pin based connector for ESA COMET-Interceptor Mission
Florian MOLIERE, European Space Agency - ESA
Gilles Beaufils

18:00

Welcome Drink

08:30

Session Chair & Introduction

Technology Roadmaps
09:00

Thales Alenia Space Roadmap on Passive Components
Valérie Boutan, Corentin Guilbert, THALES ALENIA SPACE, FR
 Dominique Ducasse

New Developments
09:20

Development of HYPERBITS Employing S-FECT Technology for High Data Rate Applications
Gaby Cristian Mindreci, PERFORMANCE INTERCONNECT SAS

Test, Reliability & Evaluation for space
09:40

Qualification Challenges and Approaches for Cryogenic Temperature Testing of EEE Components in the ESA ARIEL Science Mission
Manuel Sánchez, Alter Technology TÜV NORD
Léo Farhat, ESA

New Developments
10:00

Commercialization of GN3 Graphene Material as an Active Electrode for High Energy Supercapacitors
Tomas Zednicek, EPCI
Veronika Sedajova, Luca Primavesi, Michal Otyepka

New Developments
10:20

Development of a new Fast-Locking RF Connector Interface up to W-Band
Olivier Berenfeld, RADIALL SA
Ronan Cranny, AXON' cable

Technology Roadmaps
10:40

The latest activities related to the passive components in JAXA
Kensuke Shiba, JAXA
Koichi Suzuki

11:00

Networking Break

Technology Roadmaps
11:30

Unlocking the Future of Space Electronics with the Advanced Manufacturing Revolution
Rita Palumbo, ESA

Technical Introduction of Components (TICs)
11:50

TICs: 7 min per TIC

     

A Modular High Speed Twinax and Coax Connector System for Spacecraft Datalinks

Glenair GmbH, Germany

Improved knowledge of the thermal behaviour of space-qualified CCM and SESI

Exxelia, France

Microcrystal - The art of quartz-based timing components

Micro Crystal AG, Switzerland

Secure fast lock nano D connectors and small, low cost, quick locking composite connectors

Axon, France

Tinning of passives and compact components to prevent tin whiskers, to the GEIA standard

Retronix Inc, Great Britain

EP2 high energy Ta capacitor and modules for high voltage, energy storage and pulse power

Vishay, France

High Power SIW components for telecom satellite missions

Ecliptic DS, Cyprus 

BizLink ESCC Cables and custom solutions for space applications Bizlink, Germany
Space Oscillator Portfolio of Microchip VOP Microchip, Germany

13:00

Lunch

Parallel Session : Newton 1
14:30

3D printing of passive electronic components from the perspective of a components manufacturer
Hugo Karre, TDK Electronics
Johann Pichler

Parallel Session : Newton 2
14:30

High Frequency Behavior of CHA Series Resistors Following AEC-Q200 Qualification Tests
Alexandre Moulin, Vishay SA

Parallel Session : Newton 1
14:50

New Additive Manufacturing Technology for Space Applications
Bill Rhyne, Nuvotronics
Jean-Marc Rollin, Tim Smith

Parallel Session : Newton 2
14:50

Development of highly integrated W-band circulators/isolators based on Substrate Integrated Waveguide (SIW) technology
Henrik Kettunen, Harp Technologies Ltd
Huy Nguyen, Sampo Salo, Juha Kainulainen, Mikko Kantanen, Markku Lahti, Pekka Rantakari, Léo Farhat, Joaquin Jimenez

Parallel Session : Newton 1
15:10

Passive Massive MIMO Hybrid RF-Perovskite Energy Harvesting Frontend for LEO Satellite Applications
Fanuel Elias, Manchester Metropolitan University
Sunday Ekpo, Stephen Alabi, Sunday Enahoro, Mfonobong Uko, Rahul Unnikrishnan, Kolawole Olasunkanmi, Muhammad Ijaz, Helen Ji

Parallel Session : Newton 2
15:10

MINCOR - Minimisation of Crystal oscillator cosmic radiation effects
Nicolas Gufflet, RAKON
Laurent Couteleau, Frederic Vittrant

Parallel Session : Newton 1
15:30

High Energy Density Supercapacitors for Space Applications: A Leap Forward in Space Exploration Energy Systems

Victoria Manzi, Swistor

Parallel Session : Newton 2
15:30

CAD-to-FAB: an introduction to the recent and ongoing investment in the capability to
produce, at scale a variety of planar RF passive structures.
Alan McNeill, TRAK Microwave Limited

Parallel Session : Newton 1
15:50

COTS-Plus / Alternate Grade bulk capacitor for LEO flight Platforms
Slavomir Pala, Kyocera AVX components
Ron Demcko

Parallel Session : Newton 2
15:50

Novel Safe-Life concept for circuit protection devices
Bruno Zemp, SCHURTER AG
Elmehdi Moradi

Parallel Session : Newton 1
16:10

Hybrid energy Storage Based on Supercapacitors and Conventional Batteries system for Nanosatellite Applications
Faiza Arezki, Algerian Space Agency
Mohammed Beldjehem, Messaoud Bensaada

Parallel Session : Newton 2
16:10

Towards W-band self-biased circulators for next generation of VHTS payload
Vincent LAUR, Lab-STICC / UBO
Evan Roue, Alexis Chevalier, Gérard Tanné, Richard Lebourgeois, Olivier Vendier, Rachid Jaoui

16:30

Networking break

Interactive Panel Discussion
16:50

"Advancing Space Exploration: The Role of AI Across the Entire EEE Life Cycle"

19:30

Gala Dinner @ Beach Pavilion "De Zeemeeuw", Kon. Wilhelmina Boulevard 108, Noordwijk

08:30

Session Chair & Introduction

Technology Roadmaps
09:00

Airbus DS Roadmap
Laurent Toudret, Airbus Defence and Space

New Developments
09:20

Solid State Polymer Multilayer Capacitors for High Temperature Applications
Angelo Yializis, Polycharge America INC
Paul Roop

New Developments
09:40

High-density PCB assemblies for space applications: from evaluation to qualification
Maarten Cauwe, IMEC
Chinmay Nawghane, Marnix Van De Slyeke, Alexia Coulon, Thibault André, Stan Heltzel

New Developments
10:00

Innovative integrated magnetic for DAB power converter
Bruno Cogitore, Exxelia
Benoit Krafft

New Developments
10:20

Space grade S-band high power isolator development
Ernő Lakatos, TKI-Ferrit Ltd

10:40

Networking break

Evaluation & Qualification
11:00

Stress Testing of Chip Aluminum Polymer Capacitors
Alexander Teverovsky, Jacobs Technology Inc.

New Developments
11:20

Graphene-based bank of supercapacitors from electrode to system level
Dorela Hoxha, Pleione Energy S.A.
Athanasios Masouras, Antonios Vavouliotis, Zampia Kalogridi, Andreas Gronbach, Sarah Hartmann, Leo Farhat, Joaquín José Jiménez Carreira, Geraldine Palissat

New Developments
11:40

Latching Solid state relay replacing mechanical relay
Thomas Bayat, Isocom Limited

New Developments
12:00

Significant improvements in energy density of nanocomposite dielectric capacitors with nanoparticle surface engineering
William Greenbank, University of Southern Denmark
Bartosz Gackowski, Shova Neupane, Luciana Tavares, Thomas Ebel

Test, Reliability & Evaluation for space
12:20

Failure Analysis after in-orbit anomaly on COMEPA bimetallic thermostat TH47
Florian Krimmel, ESA/ESTEC
Michele Muschitiello, Joaquín Jiménez, Léo Farhat

12:40

Closing Session & Award Ceremony

13:00

Lunch