Past Events Proceedings

All Proceedings

Welcome Speech

Presentation

European roadmap for passive components
ESA/CNES/DLR

Presentation
Normative System & Standards

SMT approval verification procedure in compliance with new draft ECSS-Q-ST-70-38 standard
Carole Villette
ESA - European Space Agency, The Netherlands

Presentation
New Developments

SAFECAP : Ionic Liquid Supercapacitor
CB Buffry
HUTCHINSON RESEARCH CENTER, France

Presentation Final Paper
New Developments

Silicon Capacitors - Development and Space Pre-Evaluation
J. Sanchez del Rio Saez, E.Cordero Cordero, D. Lopez Lopez, Mr Lengignon, Dr L. Farhat
Alter Technology, Spain IPDIA, France ESA - European Space Agency/Product Assurance & Safety Department, Netherlands

Presentation
New Developments

Polymer Tantalum Capacitors for Advanced High Reliability Applications
JP Petrzilek, MU Uher, MB Biler
AVX Czech Republic s.r.o., Czech Republic

Presentation Final Paper
New Developments

Evaluation of a new ceramic dielectric for both low and high voltage applications
H.M LAVILLE, PS ESCURE
EXXELIA TECHNOLOGY, France

Presentation Final Paper
Technical Introduction of Components (TICs)

Exxelia Group, 30 years expertise in the design and manufacture of passive components for Space
ME EVRARD
Exxelia Group (Exxelia Supply), PARIS, France

Presentation
Technical Introduction of Components (TICs)

H.C. Starck, whenever it is about Ta, W, Nb, Mo and Re
MS Stenzel
H.C. Starck GmbH, MUNICH, Germany

Presentation
Technical Introduction of Components (TICs)

High performance space OCXO
FG Goulven
Rakon France SAS, MOUGINS, France

Presentation
Technical Introduction of Components (TICs)

New Temperature sensors for space applications
OS Sacchet
Innovative Sensor Technology, EBNAT-KAPPEL, Switzerland

Presentation
Technical Introduction of Components (TICs)

Nicomatic, Creative interconnect solutions for Space Market
S. Demathieu
Nicomatic, Bons-En-Chablais, France

Presentation
New Developments

Low-loss millimeter-wave self-biased circulators : materials, design and characterization
VL Laur, RL Lebourgeois, EL Laroche, JLM Mattei, PQ Queffelec, JPG Ganne, GM Martin
Lab-STICC / UBO, France Thales Research & Technology, France Chelton Telecom & Microwave trading as Cobham Microwave, France

Presentation Final Paper
New Developments

Surface mountable compact Ka-band filter in multilayer micromachining technology
P. Farinelli
RF Microtech, Italy

Presentation Final Paper
New Developments

Nanoprocessing and micromachining technologies of GaN/Si for sensors and filters operating at frequencies above 5 GHz
A. Muller, G. Konstantinidis, S. Iordanescu, A. Stavrinidis, A. Stefanescu, I. Giangu, A. Dinescu, T. Kostopoulos
IMT - Bucharest, Romania FORTH-IESL-MRG Heraklion, Greece

Presentation Final Paper
New Developments

Connector Press-Fit Technology for space-flight applications
JBS Sauveplane, GCM Mindreci, DM Morilla
CNES, France POSITRONIC, France ALTER Technology, Spain

Presentation Final Paper
New Developments

Multi-modular power and RF miniature connectors
NK Kellett, GR Rouchaud
Axon' Cable Ltd, United Kingdom Axon' Cable SAS, France

Presentation Final Paper
Technology Roadmaps

Basic Approach of JAXA Parts Program related to Passive Parts JAXA

Presentation
Materials and Processes

Passive component embedding in printed circuit boards for space applications
MC Cauwe, BVDC Vandecasteele, GS Schmid, CG Galler, JDH De Hert, SDC De Cuyper
Imec, Belgium AT&S, Austria QinetiQ Space, Belgium

Presentation Final Paper
Materials and Processes

Highest capacitance at higher voltages: Pushing the limits of tantalum high voltage capacitors
M. Hagymási
H.C. Starck, Germany

Presentation Final Paper
Materials and Processes

Printed heaters for non-planar space applications
D. Godlinski, R. Dr. Schlitt
Fraunhofer IFAM, Germany 2OHB System AG, Germany

Presentation Final Paper
Materials and Processes

Minibend CTR - Phase Invariant Cable Assemblies
Hasteen Jobalia
HUBER+SUHNER Astrolab, United States of America

Presentation Final Paper Best Paper Award
Materials and Processes

Recent Developments in Coaxial Interconnection Cable Materials to Minimize Temperature Induced Phase Errors
David Slack
Times microwave, United States of America

Presentation Final Paper
Application, Trends & Needs

Improving overall RF system performance by using coaxial splitters, combiners and couplers with integral isolators
S. Liller
Airbus, United Kingdom

Presentation Final Paper
Application, Trends & Needs

Improving Signal Integrity performance in high speed integrateds circuit packages with application of coaxial wire-bonding technology
B.R. Rosenberger
Rosenberger Hochfrequenztechnik, Germany

Presentation
Application, Trends & Needs

Spring probe contact solutions for solderless interconnections (Interposers)
CM Carlson
Smiths Connectors, France

Presentation Final Paper
Application, Trends & Needs

Why and how to use tantalum capacitors in satellites secondary DC Bus?
ME EVRARD, BR mr RONSE
Exxelia Group (Exxelia Supply), France Exxelia Sic-Safco, France

Presentation Final Paper
Technical Introduction of Components (TICs)

European Passive Components Institute Introduction
Tomas Zednicek
EPCI, Czech Republic

Presentation
Technical Introduction of Components (TICs)

ACSIEL MIL-AEROSPACE Working Group presentation
AR ROUGIER
RAKON, France

Presentation
Technical Introduction of Components (TICs)

Very High power TNC connectors
Olivier Berenfeld
Radiall, France

Presentation
Technical Introduction of Components (TICs)

NEW THERMOSTAT 100 VDC
MR GUILLOCHE
COMEPA INDUSTRIES, France

Presentation
Technical Introduction of Components (TICs)

SPACE SPLICE - What is it?
RA ANTOINE
C&K Components, France

Presentation
Technology Roadmaps

TAS Road Map
T. Ihorai, D. Ducasse, M. Boyer
Thales Alenia Space France, France

Presentation
Application, Trends & Needs

Evaluation and Qualification of Commercial Off-The-Shelf Supercapacitors for Space Applications
BF FAURE, LC COSQUERIC, VG GINESTE, DL LATIF, PV VASINA, DL LACOMBE, BB BÜRGLER, MS SIMCAK
AIRBUS DEFENCE AND SPACE, France EGGO Space s.r.o.,, Czech Republic European Space Agency (ESTEC),, Netherlands CSRC spol. s.r.o., Czech Republic

Presentation Final Paper
Application, Trends & Needs

High data rate solutions with new cable and connector technologies
NK Kellett, GR Rouchaud, SH Hermant, KE Enouf
Axon' Cable Ltd, United Kingdom Axon' Cable SAS, France

Presentation Final Paper
Application, Trends & Needs

Piezoelectric components for usual space and cryogenic environment
FB Barillot, FBo Bourgain, CBy Belly, C. Allegranza, D. Lacombe
Cedrat Technologies, France ATG-Europe B.V., Nederland ESA, Nederland

Presentation
Application, Trends & Needs

Assessment of the Rules on Heater De-Rating
R. Schlitt, B.C. Sander, B. Bonnafous
OHB System AG, Germany Zarm-Technik,, Germany ESA, Netherlands

Presentation Final Paper
Interactive Panel Discussion

Capacitors - Lessons from Industry - EDIF

Presentation
Interactive Panel Discussion

Commercial vs Space - EPCI

Presentation
Technology Roadmaps

ADS Roadmap for passive components
Airbus D&S

Presentation
Test, Reliability & Evaluation for space

ESTEC's Materials and Electrical Components Laboratory capabilities on testing passive components.
J. Jimenez Carreira, NC Carthew
ATG-EUROPE for ESA/ESTEC, Nederland Ajilon B.V. for ESA/ESTEC, Nederland

Presentation
Test, Reliability & Evaluation for space

Feedback of 5 years of failure analysis on passive components from all electronic sectors .
BM MOREAU, EZ mr ZAIA
SERMA TECHNOLOGIES, France

Presentation
Test, Reliability & Evaluation for space

Effects of ambient atmosphere on reliability of solid tantalum capacitors
Y. Freeman, P. Lessner
KEMET Electronics Co, United States of America

Presentation Final Paper
Test, Reliability & Evaluation for space

Evaluation of 10V chip polymer tantalum capacitors for space application
A.T. Teverovsky
ASRC, United States of America

Presentation Final Paper
Test, Reliability & Evaluation for space

Miniaturization of metallized polyester film capacitors
Tchavdar DOYTCHINOV
Exxelia Technologies (Eurofarad), France

Presentation Final Paper
Evaluation & Qualification

Evaluation and qualification of ferrite isolators and circulators for space applications
J.M. Bureau, A. Boisse, E. NGO MANDAG, S. Kurt, E. Laroche
COBHAM MICROWAVE, France

Presentation Final Paper
Evaluation & Qualification

SMP-LOCK? THE ULTIMATE SECURE CONNECTION
Olivier Berenfeld
Radiall, France

Presentation Final Paper
Evaluation & Qualification

Custom-designed circuit protection solutions for future space applications
B. Zemp, P. Straub, T. Flury
SCHURTER AG, Switzerland

Presentation Final Paper
Evaluation & Qualification

Design, Manufacture and Test Techniques for Multipactor Free RF Devices
KS Shamsaifar, T. Rodriguez, J. Haas
Sierra Microwave Technology, United States of America

Presentation Final Paper
Evaluation & Qualification

Tantalum SMD capacitors with manganese dioxide and conductive polymer counter electrode for space  applications
A.T. Tomás, CMC Mota Caetano, RM Monteiro, DL Lacombe
KEMET, SA Portugal, Portugal ESTEC: European Space Research and Technology Centre, Nederland

Presentation Final Paper
Evaluation & Qualification

Base Metal Ceramic Capacitor Design and Manufacturing for Space and Military applications.
E.J. Marshall, F mr Hodgkinson
AVX Ltd., United Kingdom

Presentation
Evaluation & Qualification

Ultra-miniature, ultra-rugged, and ultra-stable high performance Space grade OCXO and high reliability 5x7mm SMT 4-point mount crystal oscillators for space applications.
R. Duong
Q-TECH CORPORATION, Taiwan

Presentation